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Lin: MEMS Post-Packaging by Localized Heating Lin's research efforts focus on microelectromechanical systems (MEMS) with the goal of developing a MEMS post-packaging process by localized heating as well as a versatile MEMS post-packaging process for prefabricated MEMS wafers. MEMS is one of the next generation technologies of critical importance to the economy and competitiveness of the U.S. It has emerged from integrated circuit (IC) technologies, where up to 95 percent of the manufacturing cost may come from the packaging process. MEMS packaging is more difficult than the IC packaging but Lin plans to develop a versatile MEMS post-packaging process that can overcome the rigorous packaging requirements of wafer-level process, low temperature, hermetic sealing, and long-term stability. Localized heating provides a new approach to solving the bonding problem by creating hermetic and strong bonding while keeping the temperature outside the bonding area low. As a result, new bonding materials and better, faster, and stronger bonding mechanisms can be created. The teaching aspect of Lin's grant includes the introduction of two new courses, including ME 553 MEMS for senior/graduate students and Advanced MEMS, a graduate level course that emphasizes MEMS hands-on experiences in microfabrication processes and MEMS testing. Lin will also introduce six innovative mentoring and outreach programs, including a MEMS focused study group, MEMS summer camp, industrial internship, student exchange program, undergraduate MEMS design projects, and joint research projects. Lin also plans to create a research/teaching laboratory. Lin's NSF CAREER funding is from the Division of Electrical and Communication Systems (Solid State Microstructures). Endres - Lin Peng